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Article
Modeling of Flip-Chip-Bonded and Wire-Bonded MCM Interconnects for Electrical Performance Comparison
International Journal of Microcircuits and Electronic Packaging (1994)
  • Guna S Selvaduray, San Jose State University
  • A. Singh
Keywords
  • Modeling,
  • Flip-Chip-Bonded,
  • Wire-Bonded,
  • MCM,
  • Interconnects,
  • Electrical,
  • Performance,
  • Comparison
Disciplines
Publication Date
1994
Citation Information
Guna S Selvaduray and A. Singh. "Modeling of Flip-Chip-Bonded and Wire-Bonded MCM Interconnects for Electrical Performance Comparison" International Journal of Microcircuits and Electronic Packaging Vol. 17 Iss. 1 (1994)
Available at: http://works.bepress.com/guna_selvaduray/61/