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Article
Effects of Intermetallic Compound Formation on the Electrical Performance of Wirebonded Interconnects
International Journal of Microcircuits and Electronic Packaging (1996)
  • Guna S Selvaduray, San Jose State University
  • S. Trigwell
  • A. Singh
Disciplines
Publication Date
1996
Citation Information
Guna S Selvaduray, S. Trigwell and A. Singh. "Effects of Intermetallic Compound Formation on the Electrical Performance of Wirebonded Interconnects" International Journal of Microcircuits and Electronic Packaging Vol. 19 Iss. 1, First Quarter (1996)
Available at: http://works.bepress.com/guna_selvaduray/56/