Presentation
Effect of flux type and surface coating on the wetting force between copper and eutectic pb-sn solder
TMS Annual Meeting
(1997)
Abstract
The manner in which solders interact with copper, the primary material of construction for lead frames, will affect the long term reliability of microelectronic devices assembled on printed wiring boards. The effect of soldering atmosphere, presence or absence of coating on copper substrates and type of flux used, on the maximum wetting force and time to wetting were investigated. The maximum wetting force was found to be affected primarily by the types of coating and fluxes used, rather than the atmosphere. The time to wetting was also found to be affected by the types of coating and fluxes used. It was also found that the coating and flux affect the results in an interactive manner, and that this needs further investigation in order to be able to delineate the effects of each.
Disciplines
Publication Date
February, 1997
Location
Orlando, FL, USA
Comments
February 10-13, 1997
Citation Information
Guna S Selvaduray, Wayne Lee and Shelgon Lee. "Effect of flux type and surface coating on the wetting force between copper and eutectic pb-sn solder" TMS Annual Meeting (1997) Available at: http://works.bepress.com/guna_selvaduray/124/