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Article
Modal Acoustic Emission of Damage Accummulation in Woven SiC/SiC at Elevated Temperatures
Review of Progress in Quantitative Nondestructive Evaluation
  • Gregory N. Morscher, National Aeronautics and Space Administration
Location
Snowbird, UT, USA
Start Date
1-1-1999 12:00 AM
Description

Traditional [2] acoustic emission (AE) has been used to monitor the damage which occurs under tensile loading for ceramic composites tested at room temperature [3–9]. These studies have shown that AE is very effective at determining the onset of damage and to some extent the amount and type of damage (matrix cracking, fiber breaks, etc.ï). However, due to the modal nature of actual acoustic emission waveforms in thin plates [10–11], the ability to determine the precise location of the sources of the AE signals is very suspect. The dispersive differences in the extensional (symmetric) and flexural (antisymmetric) modes of the waveform as well as the change in the speed of sound due to the reduction in modulus of the composite as damage occurs account for the difficulty in precise source location.

Book Title
Review of Progress in Quantitative Nondestructive Evaluation
Chapter
Chapter 1: Elastic Waves and Ultrasonic Techniques
Section
Acoustic Emission Applications
Pages
419-426
DOI
10.1007/978-1-4615-4791-4_52
Language
en
File Format
application/pdf
Citation Information
Gregory N. Morscher. "Modal Acoustic Emission of Damage Accummulation in Woven SiC/SiC at Elevated Temperatures" Vol. 18A (1999)
Available at: http://works.bepress.com/gregory_morscher/2/