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Optimization of wire loop height for a cavity down plastic pin grid array package
Journal of Electronic Packaging (1998)
  • Freidoon Barez, San Jose State University
A study has been conducted to resolve wire neck break problem in a cavity-down plastic pin grid array (PPGA) packages with a specific range of parameters when subjected to temperature cycle (−55°C/+125°C). In most cases, a weak or broken neck of the wire was observed after 300 cycles of temperature cycling. The objective of this study is to determine an optimum wire loop height so that the package can pass a 1000 temperature cycles. Results of a simulation study, performed by other researchers, using a finite element model (FEM) were utilized. Their work considered the effect of temperature cycling on PPGA packages identical to those in this report. Several possible factors that can contribute to this failure mechanism were analyzed, and stresses in the wires were evaluated. The simulation results were verified by running an experiment on actual parts. The parts were subjected to temperature cycling, and data was gathered at different test points. The experimental results obtained did concur with simulation results which suggested that the area just above the ball experienced a significant level of thermal stresses, and such stresses could be reduced by determining an optimum loop height. Copyright © 1998 by The American Society of Mechanical Engineers
  • optimization,
  • wire loop,
  • cavity
Publication Date
January, 1998
Publisher Statement
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Citation Information
Freidoon Barez. "Optimization of wire loop height for a cavity down plastic pin grid array package" Journal of Electronic Packaging Vol. 120 Iss. 2 (1998)
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