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Study on coarsening of Ag3Sn intermetallic compound in the Fe-modified Sn-1Ag-0.5Cu solder alloys
Journal of Alloys and Compounds (2015)
Abstract

The present study focuses on coarsening of Ag3Sn intermetallic compound in the Sn-1Ag-0.5Cu and Fe-modified Sn-1Ag-0.5Cu solder alloy. The investigations showed that the Ag3Sn intermetallics coarsened rapidly in the Sn-1Ag-0.5Cu solder alloy whereas the Ag3Sn intermetallics were found to be quite stable in the Fe-modified Sn-1Ag-0.5Cu solder alloy. The lattice strain in the Ag3Sn intermetallics and the blocking effect on Ag diffusivity in Sn matrix suggested the possible mechanisms for the coarsening suppression of the Ag3Sn intermetallics in the Fe-modified solder alloy. (C) 2014 Elsevier B.V. All rights reserved. Link to Full-Text Articles : http://www.sciencedirect.com/science/article/pii/S0925838814024621

Keywords
  • ag3sn intermetallics,
  • coarsening,
  • fe addition,
  • lead-free solder,
  • mechanical-properties,
  • tensile properties,
  • microstructural evolution,
  • snagcu solder,
  • 2 wt.percent,
  • sn,
  • cu,
  • joints,
  • interfaces
Publication Date
February 15, 2015
Publisher Statement
Au6ze Times Cited:0 Cited References Count:28
Citation Information
"Study on coarsening of Ag3Sn intermetallic compound in the Fe-modified Sn-1Ag-0.5Cu solder alloys" Journal of Alloys and Compounds Vol. 622 (2015)
Available at: http://works.bepress.com/facultyofengineering_universityofmalaya/164/