Research Professor
Ephraim Suhir is on the faculty of the Portland State University, Portland, OR, USA, and Bordeaux Univ., France. He is also CEO of a Small Business Innovative Research (SBIR) ERS Co. in Los Altos, CA, USA, is Foreign Full Member of the National Academy of Engineering, Ukraine (he was born in that country); Life Fellow of the Institute of Electrical and Electronics Engineers (IEEE), the American Society of Mechanical Engineers (ASME), the Society of Optical Engineers (SPIE), and the International Microelectronics and Packaging Society (IMAPS); Fellow of the American Physical Society (APS), the Institute of Physics (IoP), UK, and the Society of Plastics Engineers (SPE); and Associate Fellow of the American Institute of Aeronautics and Astronautics (AIAA). Ephraim has authored 500+ publications, presented numerous plenary, keynote, invited and contributed talks and taught continued education courses worldwide. He received many professional awards, including 1996 Bell Labs. Distinguished Member of Technical Staff (DMTS) Award (for developing effective methods for predicting the reliability of complex structures used in AT&T and Lucent Technologies products), and 2004 ASME Worcester Read Warner Medal (for outstanding contributions to the permanent literature of engineering and laying the foundation of a new discipline “Structural Analysis of Electronic Systems”). He is the third “Russian American”, after S. Timoshenko and I. Sikorsky, who received this prestigious award. Ephraim's most recent awards are 2023 SHEN International Research Award on Science, Health and Engineering for the paper "Probabilistic Fitts' Law and the Likelihood of the Tunguska Type of Event," Journal of Space Safety Engineering, 10(1), March 2023; 2019 IEEE Electronic Packaging Society (EPS) Field award (for seminal contributions to mechanical reliability engineering and modeling of electronic and photonic packages and systems); 2019 IMAPS Lifetime Achievement award (for making exceptional, visible, and sustained impact on the microelectronics packaging industry and technology) and 2022 IEEE SCV Section Outstanding Engineer award (for seminal contributions to several critical IEEE fields, including probabilistic design-for-reliability of microelectronic and photonic materials, devices and systems, and the role of the human factor).
×
About Ephraim Suhir
Ephraim Suhir is on the faculty of the Portland State University, Portland, OR, USA, and Bordeaux Univ., France. He is also CEO of a Small Business Innovative Research (SBIR) ERS Co. in Los Altos, CA, USA, is Foreign Full Member of the National Academy of Engineering, Ukraine (he was born in that country); Life Fellow of the Institute of Electrical and Electronics Engineers (IEEE), the American Society of Mechanical Engineers (ASME), the Society of Optical Engineers (SPIE), and the International Microelectronics and Packaging Society (IMAPS); Fellow of the American Physical Society (APS), the Institute of Physics (IoP), UK, and the Society of Plastics Engineers (SPE); and Associate Fellow of the American Institute of Aeronautics and Astronautics (AIAA). Ephraim has authored 500+ publications, presented numerous plenary, keynote, invited and contributed talks and taught continued education courses worldwide. He received many professional awards, including 1996 Bell Labs. Distinguished Member of Technical Staff (DMTS) Award (for developing effective methods for predicting the reliability of complex structures used in AT&T and Lucent Technologies products), and 2004 ASME Worcester Read Warner Medal (for outstanding contributions to the permanent literature of engineering and laying the foundation of a new discipline “Structural Analysis of Electronic Systems”). He is the third “Russian American”, after S. Timoshenko and I. Sikorsky, who received this prestigious award. Ephraim's most recent awards are 2023 SHEN International Research Award on Science, Health and Engineering for the paper "Probabilistic Fitts' Law and the Likelihood of the Tunguska Type of Event," Journal of Space Safety Engineering, 10(1), March 2023; 2019 IEEE Electronic Packaging Society (EPS) Field award (for seminal contributions to mechanical reliability engineering and modeling of electronic and photonic packages and systems); 2019 IMAPS Lifetime Achievement award (for making exceptional, visible, and sustained impact on the microelectronics packaging industry and technology) and 2022 IEEE SCV Section Outstanding Engineer award (for seminal contributions to several critical IEEE fields, including probabilistic design-for-reliability of microelectronic and photonic materials, devices and systems, and the role of the human factor).
| Present | Research Professor, Portland State University ‐ Mechanical & Materials Engineering | |
|
|
||
Disciplines
Research Interests
Applied Mathematics and Mechanics, Applied and Mathematical Physics, Analytical ("Mathematical") Modeling in Applied Science and Engineering, Materials Science and Engineering, Aerospace and Automotive Electronics and Photonics, Design for Reliability (DfR) of Electronic, Opto-Electronic and Photonic Assemblies, Packages and Systems, Applied Probability and Probabilistic DfR (PDfR) of Electronic and Photonic Materials, Devices and Systems, Photonics, Fiber Optics, Mechanics of Optical Fibers, Thin Film Mechanics and Physics, Shock and Vibration Analyses and Testing, Dynamic Response of Materials and Structures to Shocks and Vibrations, Thermal Stress Analysis in Electronics and Photonics, Prediction and Prevention of Thermal Stress Failures, Solder Materials and Solder Joint Interconnections in Electronic and Photonic Engineering, Polymeric Materials in Electronics and Photonics, Photovoltaic and Thermo-Electric Modules: Physical Design for Reliability, Stretchable (Large Area) Electronics and Photonics: Physical Design for Reliability, Lattice-Misfit Systems: Stress Analysis and Reliability Evaluations, Technical Diagnostics, Prognostics and Health Monitoring (PHM), Vehicular (Aerospace, Automotive, Maritime, Railroad) Electronics and Photonics: Design for Reliability, “Human-in-the-Loop”: Human-System Interaction and Integration, Analytical ("Mathematical") Modeling, and "Quantifying Unquantifiables" in Materials Science and Engineering, Reliability Physics and Ergonomins
Honors and Awards
- *Recent Awards*
- 2023 SHEN International Research Award on Science, Health and Engineering for the paper "Probabilistic Fitts' Law and the Likelihood of the Tunguska Type of Event," Journal of Space Safety Engineering, 10(1), March 2023
- 2022 IEEE SCV Section Outstanding Engineer Award "for seminal contributions to several critical IEEE fields, including probabilistic design-for-reliability of microelectronic and photonic materials and systems, and the role of the human factor".
- 2021 ASME ISPS Distinguished Speaker Award for the presentation “Thermal Stress Failures in Electronic and Photonic Packaging: Prediction and Prevention”. Presented at the 2021 ASME ISPS Virtual Conference, June 2-3, 2021
- 2019 IMAPS Lifetime Achievement Award “for making exceptional, visible, and sustained impact on the microelectronics packaging industry in technology, business or both”. Bestowed at the 52nd IMAPS Symp. on Microelectronics, Boston, Mass., Oct.1 , 2019.
- 2019 IEEE EPS Electronic Packaging Field Award, “for seminal contributions to mechanical reliability engineering and modeling of electronic and photonic packages and systems.” Bestowed at the IEEE EPS conference, Las Vegas, NV, May 30, 2019
- 2018 IMAPS 51-st Int. Symposium on Microelectronics “best of session” Award for the presentation “Elevated stand-off heights of solder joint interconnections of surface mounted IC packages result in an appreciable stress and warpage relief.”
- 2017 IMAPS Daniel C. Hughes, Jr. Memorial Award, the most prestigious annual honor for the greatest combination of technical achievements in microelectronics, contributions in the microelectronics industry, academic achievement, or support and service.
- 2017 IEEE EPS Exceptional Technical Achievement (ETA) Award “for the development of numerous probabilistic design concepts that enable effective and rapid assessment of the probability of failure of electronic products.
| Ph.D., Moscow State University, Moscow, Russia ‐ Mechanics and Mathematics | ||
|
|
||
| M.S., Institute of Maritime Engineers, Odessa, Ukraine ‐ Naval Architecture | ||
|
|
||
