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SEDS: Expanding TEDS to include physical structures
2018 IEEE Sensors Applications Symposium (2018)
  • Brian Dixon, Rowan University
  • George Lecakes, Rowan University
  • Paul K. Moon, Rowan University
  • John Schmalzel, Rowan University
Due to the increasingly complex nature of systems, there are benefits in expanding the IEEE 1451.x Transducer Electronics Data Sheet (TEDS) standards to include the physical structures included in these systems. In this paper, we present a format and methodology for Structural Electronics Data Sheets (SEDS) to accurately describe sensor housings, generic enclosures, test chassis, and instrumentation fixtures. SEDS provides the additional functionality to complement systems, such as automatic calibration and compensation of environmental factors that influence the system's physical aspects. We propose the standard's starting point for both SEDS contained on memory as well as a virtual SEDS, accessible from a source external to the structure.
  • Transducers,
  • IEEE Standard,
  • Sensors,
  • NCAP,
  • TEDS,
  • TIM,
  • vTEDS
Publication Date
March 12, 2018
Seoul, South Korea
Citation Information
Brian Dixon, George Lecakes, Paul K. Moon and John Schmalzel. "SEDS: Expanding TEDS to include physical structures" 2018 IEEE Sensors Applications Symposium (2018)
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