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Simplified Equivalent Golden Finger Port Setup for Fast and Accurate High-Speed Channel Simulation
2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023
  • Chaofeng Li
  • Kevin Cai
  • Mehdi Mousavi
  • Manish Kizhakkeveettil Mathew
  • Bidyut Sen
  • DongHyun Kim, Missouri University of Science and Technology
Abstract

A Simplified Equivalent Golden Finger Port Setup is Proposed for Efficient, Accurate 3D Full-Wave Simulation for High-Speed Channels. the Bent Connector Pins, Which Mate with the Golden Finger, Are Simplified as Equivalent Cylindrical Pins to Meet the Wave Port Setting Requirements for 3D Full-Wave Simulation. the Effects of the Equivalent Cylindrical Pin Location and Diameter Are Analyzed through 3D Full-Wave Simulation. a Closed-Form Expression is Newly Proposed to Correlate the Location and Diameter of the Equivalent Cylindrical Pin with Respect to the Widely Used Bent Connector Pin. on the Basis of the Closed-Form Expression, the Bent Connector Pin Can Be Accurately Replaced by the Simplified Equivalent Cylindrical Pin Structure in 3D Full-Wave Simulation. Practical Examples using Commercial High-Speed Connector Pin Models with Gold Fingers Verify that the Proposed Modeling Method is Accurate and Efficient Up to 40 GHz.

Department(s)
Electrical and Computer Engineering
Comments

National Science Foundation, Grant IIP-1916535

Keywords and Phrases
  • bent connector,
  • closed-form expression,
  • equivalent cylindrical,
  • Golden finger
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2023 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
1-1-2023
Publication Date
01 Jan 2023
Citation Information
Chaofeng Li, Kevin Cai, Mehdi Mousavi, Manish Kizhakkeveettil Mathew, et al.. "Simplified Equivalent Golden Finger Port Setup for Fast and Accurate High-Speed Channel Simulation" 2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023 (2023) p. 301 - 305
Available at: http://works.bepress.com/donghyun-bill-kim/97/