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Mode-Decomposition-Based Equivalent Via (MEV) Model and MEV Model Application Range Analysis
2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility and International Conference on ElectroMagnetic Interference and Compatibility, APEMC/INCEMIC 2023
  • Chaofeng Li
  • Kevin Cai
  • Muqi Ouyang
  • Manish Kizhakkeveettil Mathew
  • Mehdi Mousav
  • Bidyut Sen
  • DongHyun Kim, Missouri University of Science and Technology
Abstract

The Mode-Decomposition-Based Equivalent Via (MEV) Model is Proposed in This Paper, which is a Physics-Based Equivalent Model for the High-Speed Channel Modeling. the Application Ranges of the MEV Model Are Analyzed by Varying Anti-Pad Radius, Via Radius, and Distance between the Parallel Plates for a Single Via with Multiple Layers. based on the S-Parameter Comparison with Full-Wave Simulations, the MEV Model is Useful for the Insertion Loss Calculation Up to 100 GHz. Meanwhile, the Return Loss from the MEV Model Shows a High Level of Correlation with Full-Wave Simulation Results Up to 70GHz, Even When the Anti-Pad Radius is Larger Than the Commonly Used Size. the Parallel-Plate Height Has a Negligible Impact on the Accuracy of the MEV Model. This Paper Demonstrates the Large Application Range of the MEV Model and Verifies that MEV Model is Suitable for Practical High-Speed Via Analysis.

Department(s)
Electrical and Computer Engineering
Comments

National Science Foundation, Grant IIP-1916535

Keywords and Phrases
  • equivalent via model,
  • high-order modes,
  • high-speed channel,
  • mode-decomposition,
  • parallel plate mode
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2023 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
1-1-2023
Publication Date
01 Jan 2023
Citation Information
Chaofeng Li, Kevin Cai, Muqi Ouyang, Manish Kizhakkeveettil Mathew, et al.. "Mode-Decomposition-Based Equivalent Via (MEV) Model and MEV Model Application Range Analysis" 2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility and International Conference on ElectroMagnetic Interference and Compatibility, APEMC/INCEMIC 2023 (2023)
Available at: http://works.bepress.com/donghyun-bill-kim/95/