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Article
Optimizing the Placement of Non-Functional Pads on Signal Vias using Multiple Reflection Analysis
2022 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2022
  • Muqi Ouyang
  • Kevin Cai
  • Chaofeng Li
  • Anna Gao
  • Felen Fu
  • Hannah Bian
  • Bidyut Sen
  • DongHyun Kim, Missouri University of Science and Technology
Abstract

In this study, the effects of using non-functional pads to optimize the performance of high-speed signal vias are investigated based on multiple reflection analysis. The non-functional pads on signal vias introduce more capacitive coupling and are possible to improve the response of the via structure if the original via has relatively larger impedance compared to the system reference impedance. The effectiveness of the non-functional pad optimization is validated through a numerical example, and the eye diagram of the via structure without and with non-functional pads are compared. The eye opening becomes 5.4 times larger after the via optimization using non-functional pads.

Department(s)
Electrical and Computer Engineering
Comments

National Science Foundation, Grant IIP-1916535

Keywords and Phrases
  • multiple reflections,
  • non-functional pad,
  • signal integrity,
  • via optimization
International Standard Book Number (ISBN)
978-166540929-2
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2023 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
1-1-2022
Publication Date
01 Jan 2022
Citation Information
Muqi Ouyang, Kevin Cai, Chaofeng Li, Anna Gao, et al.. "Optimizing the Placement of Non-Functional Pads on Signal Vias using Multiple Reflection Analysis" 2022 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2022 (2022) p. 169 - 174
Available at: http://works.bepress.com/donghyun-bill-kim/87/