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Peec-Based On-Chip Pdn Impedance Modeling using Layered Green's Function
2022 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2022
  • Chaofeng Li
  • Biyao Zhao
  • Bo Pu
  • Xu Wang
  • DongHyun Kim, Missouri University of Science and Technology
  • Jun Fan, Missouri University of Science and Technology
Abstract

This paper presents an impedance model of on-chip power distribution network (PDN), which is an efficient criterion for estimating simultaneous switching noises (SSNs) on 3-D integrated circuit (IC). The impedance of on-chip PDN, including the effect of silicon substrate, is accurately modeled based on partial element equivalent circuit (PEEC) and layered Green's function (LGF). The equivalent circuit model of PDN is extracted based on the physical dimensions and electrical material characteristic of PDN at first. And then the LGF is used to consider the effect of silicon substrate for improving the accuracy of on-chip PDN impedance model. The effectiveness of proposed model has been validated by full wave simulation. The high order resonance of PDN impedance can also be accurately predicted.

Department(s)
Electrical and Computer Engineering
Comments

National Science Foundation, Grant IIP-1916535

Keywords and Phrases
  • impedance modeling,
  • LGF,
  • PDN,
  • PEEC,
  • silicon substrate,
  • SSNs
International Standard Book Number (ISBN)
978-166540929-2
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2023 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
1-1-2022
Publication Date
01 Jan 2022
Citation Information
Chaofeng Li, Biyao Zhao, Bo Pu, Xu Wang, et al.. "Peec-Based On-Chip Pdn Impedance Modeling using Layered Green's Function" 2022 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2022 (2022) p. 164 - 168
Available at: http://works.bepress.com/donghyun-bill-kim/84/