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Article
Statistical Eye Diagrams For High-Speed Interconnects Of Packages: A Review
IEEE Access
  • Junyong Park
  • Donghyun Kim, Missouri University of Science and Technology
Abstract

An eye diagram, a critical metric in signal integrity analysis for high-speed interconnects such as packages, interposer, and printed circuit boards (PCBs), is generated by superposition of the received waveform. Obtaining an eye diagram is time-consuming, thus signal integrity analysis is inefficient. This article reviews that have been proposed to overcome this limitation. The statistical eye diagram provides a probability distribution depending on a sampling time and voltage, therefore it can be expanded to other metrics, such as the bit-error rate and shmoo plot. This article introduces previous research on statistical eye diagrams applied to complementary metal-oxide-semiconductors (CMOSs), noise, and high-speed systems. The methods applied to CMOSs include asymmetry between the P/NMOS transistors and the nonlinearity of the CMOS. The methods applied to noise include signal and power noise. The methods applied to high-speed systems include equalizers, signaling, encoding, linear feedback shift register, and error correction code.

Department(s)
Electrical and Computer Engineering
Publication Status
Open Access
Comments

National Science Foundation, Grant IIP-1916535

Keywords and Phrases
  • Complementary metal-oxide-semiconductor (CMOS),
  • crosstalk,
  • double edge response (DER),
  • encoding,
  • equalizer,
  • error correction code (ECC),
  • eye diagram,
  • multiple edge response (MER),
  • package,
  • pulse amplitude modulation (PAM),
  • signal integrity (SI),
  • single bit response (SBR),
  • statistical eye diagram
Document Type
Article - Journal
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2024 The Authors, All rights reserved.
Creative Commons Licensing
Creative Commons Attribution 4.0
Publication Date
1-1-2024
Publication Date
01 Jan 2024
Citation Information
Junyong Park and Donghyun Kim. "Statistical Eye Diagrams For High-Speed Interconnects Of Packages: A Review" IEEE Access Vol. 12 (2024) p. 22880 - 22891 ISSN: 2169-3536
Available at: http://works.bepress.com/donghyun-bill-kim/106/