Article
On-chip temperature control circuit using common devices
Proceedings of the Custom IC Conference
(2005)
Abstract
A circuit has been designed to control the temperature of the IC die upon which it resides. No special devices or layers are required. No external circuitry or special heat sinking is used. Equilibrium temperatures from below -40°C to above +85°C are attainable. Time to equilibrium is on the order of a few seconds. The 400μm × 500μm circuit has been manufactured by the MOSIS service in a TSMC 0.25 micron process and installed in a 40-pin DIP package. Test results reveal temperature regulation within 0.3°C for thermal control ranges of 4°C to 40°C.
Disciplines
Publication Date
2005
Publisher Statement
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Citation Information
F D Braun, David W Parent and T A Papalias. "On-chip temperature control circuit using common devices" Proceedings of the Custom IC Conference Vol. 215 Iss. 218 (2005) Available at: http://works.bepress.com/david_parent/32/