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Electrical Measurements in GaN: Point Defects and Dislocations
MRS Internet Journal of Nitride Semiconductor Research
  • David C. Look, Wright State University - Main Campus
  • Zhaoqiang Fang, Wright State University - Main Campus
  • Laura Polenta
Document Type
Article
Publication Date
5-1-2000
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Abstract

Defects can be conveniently categorized into three types: point, line, and areal. In GaN, the important point defects are vacancies and interstitials; the line defects are threading dislocations; and the areal defects are stacking faults. We have used electron irradiation to produce point defects, and temperature-dependent Hall-effect (TDH) and deep level transient spectroscopy (DLTS) measurements to study them. The TDH investigation has identified two point defects, an 0.06-eV donor and a deep acceptor, thought to be the N vacancy and interstitial, respectively. The DLTS study has found two point-defect electron traps, at 0.06 eV and 0.9 eV, respectively; the 0.06-eV trap actually has two components, with different capture kinetics. With respect to line defects, the DLTS spectrum in as-grown GaN includes an 0.45-eV electron trap, which has the characteristics of a dislocation, and the TDH measurements show that threading-edge dislocations are acceptor-like in n-type GaN. Finally, in samples grown by the hydride vapor phase technique, TDH measurements indicate a strongly n-type region at the GaN/Al2O3 interface, which may be associated with stacking faults. All of the defects discussed above can have an influence on the dc and/or ac conductivity of GaN.

Citation Information
David C. Look, Zhaoqiang Fang and Laura Polenta. "Electrical Measurements in GaN: Point Defects and Dislocations" MRS Internet Journal of Nitride Semiconductor Research Vol. 5S1 (2000) p. W10.5 ISSN: 1092-5783
Available at: http://works.bepress.com/david_look/367/