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EMI Coupling Paths in Silicon Optical Sub-Assembly Package
Proceedings of the 2016 IEEE International Symposium on Electromagnetic Compatibility (2016, Ottawa, Canada)
  • Jing Li
  • Xiao Li
  • Xiangyang Jiao
  • Sukhjinder Toor
  • Ling Zhang
  • Alpesh U. Bhobe
  • James L. Drewniak, Missouri University of Science and Technology
  • David Pommerenke, Missouri University of Science and Technology
Abstract

Optical transceiver modules are commonly used in telecommunication and data communications systems. These modules, which are located in the optical I/O ports at the front-end of switches and routers, are a dominating source of electromagnetic interference (EMI) problems at their operation frequency and/or harmonics. In this study, a simulation model is used to investigate the EMI coupling physics and performance of the silicon optical sub-assembly (OSA) module. Total radiation power (TRP) measurement has also been performed in a mode-stirred reverberation chamber (RC) to support the radiation mechanism analysis. The connector between the module circuit board to flex cable has been identified as the major EMI source above 15 GHz in the OSA module. This conclusion can help provide insight to EMC design engineers about the potential EMI problems in the OSA package.

Meeting Name
2016 IEEE International Symposium on Electromagnetic Compatibility (2016: Jul. 25-29, Ottawa, Canada)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
  • Electromagnetic pulse,
  • Electromagnetic wave interference,
  • Light transmission,
  • Optical switches,
  • Optical transceivers,
  • Reverberation,
  • Signal interference,
  • Coupling paths,
  • High frequency HF,
  • Mode stirred reverberation chamber,
  • Operation frequency,
  • Optical subassembly,
  • Optical transceiver modules,
  • Radiation mechanism,
  • Total radiated power,
  • Electromagnetic compatibility,
  • electromagnetic interference (EMI),
  • flex PCB
International Standard Book Number (ISBN)
978-150901441-5
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2016 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
9-1-2016
Citation Information
Jing Li, Xiao Li, Xiangyang Jiao, Sukhjinder Toor, et al.. "EMI Coupling Paths in Silicon Optical Sub-Assembly Package" Proceedings of the 2016 IEEE International Symposium on Electromagnetic Compatibility (2016, Ottawa, Canada) Vol. 2016-September (2016) p. 890 - 895 ISSN: 1077-4076
Available at: http://works.bepress.com/david-pommerenke/87/