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Designing a 3D Printing Based Channel Emulator
Proceedings of the 2014 IEEE International Symposium on Electromagnetic Compatibility (2014, Raleigh, NC)
  • Xiangyang Jiao
  • Hui He
  • Guanghua Li
  • Wei Qian
  • Guangyao Shen
  • David Pommerenke, Missouri University of Science and Technology
  • Chong Ding
  • Douglas B. White
  • Stephen A. Scearce
  • Yaochao Yang

This research explored the possibility of building channel emulators by utilizing fused deposition modeling (FDM) 3D printing technology, which provides a rapid and low cost method with high flexibility to produce parts with many shapes of interest. Algorithms are developed for obtaining the printing pattern and loss profile based on S parameters of a target channel to be emulated. Parts with different dielectric constants, and loss tangents can be printed using filament with high dielectric constant or conductive fillers. Those parts will be placed on a low loss transmission line. As a result, different channel emulators can be built with the advantage of avoiding complicated electronic components, and only being limited in the frequency range by the base trace and its connectors.

Meeting Name
2014 IEEE International Symposium on Electromagnetic Compatibility (2014: Aug. 3-8, Raleigh, NC)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
  • Electric lines,
  • Electromagnetic compatibility,
  • Frequency division multiplexing,
  • Permittivity,
  • Printing,
  • Scattering parameters,
  • Transmission line theory,
  • 3-D printing,
  • Channel emulators,
  • Conductive fillers,
  • Electronic component,
  • Fused deposition modeling,
  • High dielectric constants,
  • High flexibility,
  • Low loss transmission lines,
  • 3D printers,
  • channel emulator,
  • dielectric constants
Document Type
Article - Conference proceedings
Document Version
File Type
© 2014 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
Citation Information
Xiangyang Jiao, Hui He, Guanghua Li, Wei Qian, et al.. "Designing a 3D Printing Based Channel Emulator" Proceedings of the 2014 IEEE International Symposium on Electromagnetic Compatibility (2014, Raleigh, NC) Vol. 2014-September Iss. September (2014) p. 956 - 960 ISSN: 1077-4076
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