Characterizing Package/PCB PDN Interactions from a Full-Wave Finite-Difference FormulationProceedings of the 2006 IEEE International Symposium on Electromagnetic Compatibility (2006, Portland, OR)
AbstractA novel approach of equivalent circuit model extraction is developed for modeling of integrated package and PCB power distribution networks (PDN). The integrated PDNs are formulated from a full-wave finite-difference algorithm, and the resulting matrix equations are converted to equivalent circuits. The equivalent circuits, as well as the decoupling capacitors and the attached circuit components, can be analyzed with a SPICE-like solver in both the time and frequency domains. The modeling of dielectric loss is also addressed. The method is used to model three PDN problems including a simple power bus, a BGA package mounting on a PCB, and a 3-D power bus structure. The results are compared to either measurement data or other numerical results. The limitations of the method are also discussed.
Meeting Name2006 IEEE International Symposium on Electromagnetic Compatibility (2006: Aug. 14-18, Portland, OR)
Department(s)Electrical and Computer Engineering
Second DepartmentMaterials Science and Engineering
Keywords and Phrases
- Equivalent Circuit,
- Power Dilivery Network,
- Power Distribution Networks
Document TypeArticle - Conference proceedings
Document VersionFinal Version
Rights© 2006 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Citation InformationShishuang Sun, David Pommerenke, James L. Drewniak, Kai Xiao, et al.. "Characterizing Package/PCB PDN Interactions from a Full-Wave Finite-Difference Formulation" Proceedings of the 2006 IEEE International Symposium on Electromagnetic Compatibility (2006, Portland, OR) (2006) p. 550 - 555
Available at: http://works.bepress.com/david-pommerenke/52/