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Article
Application of Chip-Level EMC in Automotive Product Design
Proceedings of the 2006 IEEE International Symposium on Electromagnetic Compatibility (2006, Portland, OR)
  • Kuifeng Hu
  • H. Weng
  • Daryl G. Beetner, Missouri University of Science and Technology
  • David Pommerenke, Missouri University of Science and Technology
  • James L. Drewniak, Missouri University of Science and Technology
  • K. Lavery
  • Jason Whiles
Abstract

Integrated circuits (ICs) are often the source of the high-frequency noise that drives electromagnetic emissions from electronic products. A case study is presented where emissions from a printed circuit board containing an automotive microcontroller are reduced significantly through analysis of the coupling mechanisms from the chip to the board and attached cables. Noise generated by the IC is explored through measurements in a semi-anechoic chamber and TEM cell, through near-field scans, and through modifications to the printed circuit board. Noise is driven by the IC through both power and I/O connections. Results show that a ferrite in series with I/O power in this application reduced emissions by 10 dB or more at critical frequencies. Possible causes for emissions from the IC and modifications that might reduce these emissions are discussed.

Meeting Name
2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006 (2006: Aug. 14-18, Portland, OR)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
  • Automotive,
  • Coupling,
  • Emissions,
  • Electromagnetic compatibility,
  • Integrated circuits
International Standard Book Number (ISBN)
1-4244-0293-X
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2006 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
8-1-2006
Citation Information
Kuifeng Hu, H. Weng, Daryl G. Beetner, David Pommerenke, et al.. "Application of Chip-Level EMC in Automotive Product Design" Proceedings of the 2006 IEEE International Symposium on Electromagnetic Compatibility (2006, Portland, OR) (2006)
Available at: http://works.bepress.com/david-pommerenke/44/