The PCB Level ESD Immunity Study by Using 3 Dimension ESD Scan SystemProceedings of the International Symposium on Electromagnetic Compatibility, 2004. EMC 2004
AbstractThe use of high-speed logic makes modern electronic systems highly susceptible to electrostatic discharge (ESD). Because of their wider bandwidth, faster digital devices are more susceptible to high frequency ESD transient fields. In the analysis of ESD problems, an exact knowledge of the affected PINs and nets is essential for an optimal solution. A three dimensional ESD scanning system, which has been developed to record the ESD susceptibility map for a printed circuit board, is presented, and the mechanisms that the ESD event couples into the digital devices is studied.
Meeting NameInternational Symposium on Electromagnetic Compatibility, 2004. EMC 2004
Department(s)Electrical and Computer Engineering
Keywords and Phrases
- ESD Scan,
- Fast CMOS System,
- Induced Loop Voltage,
- Susceptibility Map
Document TypeArticle - Conference proceedings
Document VersionFinal Version
Rights© 2004 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Citation InformationKai Wang, David Pommerenke, Jian Min Zhang and Ramachandran Chundru. "The PCB Level ESD Immunity Study by Using 3 Dimension ESD Scan System" Proceedings of the International Symposium on Electromagnetic Compatibility, 2004. EMC 2004 (2004)
Available at: http://works.bepress.com/david-pommerenke/190/