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Article
Super Resolution Emission Source Microscopy using Water Immersion
Proceedings of the 2016 IEEE International Symposium on Electromagnetic Compatibility (2016, Ottawa, Canada)
  • Victor Khilkevich, Missouri University of Science and Technology
  • Rajashree Ghorude
  • David Pommerenke, Missouri University of Science and Technology
Abstract
A two-dimensional emission source microscopy (ESM) algorithm based on the synthetic aperture radar (SAR) technique is used for EMI source localization. The resolution of the ESM method is proportional to the wavelength of electromagnetic radiation, and at the frequency of 1 GHz, the theoretical resolution limit in air is 15 cm which is too coarse for many practical applications. The resolution can be improved if water is used as the medium between the device under test (DUT) and the receiving probe, leading to a much shorter wavelength. It is demonstrated that by using water immersion it is possible to achieve resolution of 2.5 cm at 1 GHz, which is a 6-fold improvement over a measurement in air.
Meeting Name
2016 IEEE International Symposium on Electromagnetic Compatibility (2016: Jul. 25-29, Ottawa, Canada)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
  • Design for testability,
  • Electromagnetic waves,
  • Optical resolving power,
  • Synthetic aperture radar,
  • Device under test,
  • Emission sources,
  • manual scan,
  • Microwave imaging,
  • Resolution limits,
  • Shorter wavelength,
  • Source localization,
  • Super resolution,
  • Electromagnetic compatibility,
  • EMI,
  • Emission Source Microscopy
International Standard Book Number (ISBN)
978-150901441-5
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2016 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
9-1-2016
Citation Information
Victor Khilkevich, Rajashree Ghorude and David Pommerenke. "Super Resolution Emission Source Microscopy using Water Immersion" Proceedings of the 2016 IEEE International Symposium on Electromagnetic Compatibility (2016, Ottawa, Canada) Vol. 2016-September (2016) p. 695 - 700 ISSN: 1077-4076
Available at: http://works.bepress.com/david-pommerenke/181/