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Susceptibility Scanning as Failure Analysis Tool for System-Level Electrostatic Discharge (ESD) Problems
IEEE Transactions on Electromagnetic Compatibility
  • Giorgi Muchaidze
  • Jayong Koo
  • Qing Cai
  • Tun Li
  • Lijun Han
  • Andrew Martwick
  • Kai Wang
  • Jin Min
  • James L. Drewniak, Missouri University of Science and Technology
  • David Pommerenke, Missouri University of Science and Technology
Abstract

Susceptibility scanning is an increasingly adopted method for root cause analysis of system-level immunity sensitivities. It allows localizing affected nets and integrated circuits (ICs). Further, it can be used to compare the immunity of functionally identical or similar ICs or circuit boards. This paper explains the methodology as applied to electrostatic discharge and provides examples of scan maps and signals probed during immunity scanning. Limitations of present immunity analysis methods are discussed.

Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
  • Electrostatic Discharges (ESDs),
  • Scanning,
  • Susceptibility,
  • Immunity,
  • Failure Analysis,
  • Integrated Circuits,
  • Magnetic Susceptibility,
  • Sensitivity Analysis,
  • Susceptibility Scanning,
  • System-Level Immunity Sensitivities,
  • Electrostatic Discharge,
  • Probes,
  • Immunity Testing,
  • Noise,
  • Color,
  • Couplings
Document Type
Article - Journal
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2008 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
5-1-2008
Citation Information
Giorgi Muchaidze, Jayong Koo, Qing Cai, Tun Li, et al.. "Susceptibility Scanning as Failure Analysis Tool for System-Level Electrostatic Discharge (ESD) Problems" IEEE Transactions on Electromagnetic Compatibility Vol. 50 Iss. 2 (2008) p. 268 - 276 ISSN: 0018-9375; 1558-187X
Available at: http://works.bepress.com/david-pommerenke/180/