PCB Ground Fill Design Guidelines for Radiated EMIIEEE International Symposium on Electromagnetic Compatibility, 2008. EMC 2008
AbstractThis paper is to alert PCB designers about potential EMI problems caused by ground fills in outer layers of PCB. Ground fills are frequently used on top and bottom layers of PCBs for manufacturing or perceived shielding reasons. However, if not well applied they may cause EMI problem, especially if they form resonators. Several types of situations need to be distinguished, by (1) the resonating structure and (2) the excitation structure. Examples of problematic structures are shown by simulation and measurement. Possible guidelines for mitigating such problems are discussed.
Department(s)Electrical and Computer Engineering
Keywords and Phrases
- Design Guideline,
- Ground Fill,
- Printed Circuit Board
Library of Congress Subject HeadingsPrinted circuits
Document TypeArticle - Conference proceedings
Rights© 2008 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Citation InformationWeifeng Pan, David Pommerenke, Shuai Xu and Jun Jia. "PCB Ground Fill Design Guidelines for Radiated EMI" IEEE International Symposium on Electromagnetic Compatibility, 2008. EMC 2008 (2008)
Available at: http://works.bepress.com/david-pommerenke/157/