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Article
PCB Ground Fill Design Guidelines for Radiated EMI
IEEE International Symposium on Electromagnetic Compatibility, 2008. EMC 2008
  • Weifeng Pan
  • David Pommerenke, Missouri University of Science and Technology
  • Shuai Xu
  • Jun Jia
Abstract
This paper is to alert PCB designers about potential EMI problems caused by ground fills in outer layers of PCB. Ground fills are frequently used on top and bottom layers of PCBs for manufacturing or perceived shielding reasons. However, if not well applied they may cause EMI problem, especially if they form resonators. Several types of situations need to be distinguished, by (1) the resonating structure and (2) the excitation structure. Examples of problematic structures are shown by simulation and measurement. Possible guidelines for mitigating such problems are discussed.
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
  • EMI,
  • PCB,
  • Design Guideline,
  • Ground Fill,
  • Printed Circuit Board
Library of Congress Subject Headings
Printed circuits
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2008 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
8-1-2008
Citation Information
Weifeng Pan, David Pommerenke, Shuai Xu and Jun Jia. "PCB Ground Fill Design Guidelines for Radiated EMI" IEEE International Symposium on Electromagnetic Compatibility, 2008. EMC 2008 (2008)
Available at: http://works.bepress.com/david-pommerenke/157/