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Article
Field Extraction from Near Field Scanning for a Microstrip Structure
Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, 2002
  • Lin Zhang
  • Kevin P. Slattery
  • Chen Wang
  • Masahiro Yamaguchi
  • K.-I. Arai
  • Richard E. DuBroff, Missouri University of Science and Technology
  • James L. Drewniak, Missouri University of Science and Technology
  • David Pommerenke, Missouri University of Science and Technology
  • Todd H. Hubing, Missouri University of Science and Technology
Abstract

Currents associated with high-speed digital devices have significant impacts on EMI problems in VLSI design and operation. In this paper, a simple transmission line model was implemented as an initial step to represent the EMI mechanisms associated with an IC package. Numerical modeling results were compared with near field scanning measurements and show that the magnetic field deduced from the measurements agrees well with the numerical predictions.

Meeting Name
IEEE International Symposium on Electromagnetic Compatibility, 2002
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
  • EMI Mechanisms,
  • EMI Problems,
  • IC Package,
  • VLSI,
  • VLSI Design,
  • VLSI Operation,
  • Electromagnetic Compatibility,
  • Electromagnetic Interference,
  • High-Speed Digital Devices,
  • Integrated Circuit Modelling,
  • Integrated Circuit Packaging,
  • Integrated Circuit Testing,
  • Magnetic Field,
  • Magnetic Fields,
  • Microstrip Lines,
  • Microstrip Structure,
  • Near Field Scanning Measurements,
  • Numerical Modeling,
  • Transmission Line Model,
  • Transmission Line Theory
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2002 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
1-1-2002
Citation Information
Lin Zhang, Kevin P. Slattery, Chen Wang, Masahiro Yamaguchi, et al.. "Field Extraction from Near Field Scanning for a Microstrip Structure" Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, 2002 (2002)
Available at: http://works.bepress.com/david-pommerenke/118/