Skip to main content
Article
ESD Field Coupling Study in Relation with PCB GND and Metal Chassis
Proceedings of the 20th International Zurich Symposium on Electromagnetic Compatibility, 2009. EMC Zurich 2009
  • Jong-Sung Lee
  • David Pommerenke, Missouri University of Science and Technology
  • Jae-Deok Lim
  • Byong-Su Seol
Abstract
This work demonstrates a simple experimental setup to measure ESD-induced voltage to traces on a printed circuit board when ESD current is injected directly onto the outside of a metal case and presents how the induced voltage can be affected by the physical structure of the PCB ground and the metal case. The correlation between ESD-induced voltage and the method of connecting the PCB and chassis grounds shall be discussed, as well as how the PCB ground fill affects ESD. These experimental results may provide guidance for a better design for ESD immunity.
Meeting Name
20th International Zurich Symposium on Electromagnetic Compatibility, 2009. EMC Zurich 2009
Department(s)
Electrical and Computer Engineering
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2009 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
1-1-2009
Citation Information
Jong-Sung Lee, David Pommerenke, Jae-Deok Lim and Byong-Su Seol. "ESD Field Coupling Study in Relation with PCB GND and Metal Chassis" Proceedings of the 20th International Zurich Symposium on Electromagnetic Compatibility, 2009. EMC Zurich 2009 (2009)
Available at: http://works.bepress.com/david-pommerenke/102/