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Article
A Practical Simulation Flow for Singing Capacitor based Acoustic Noise Analysis
2022 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2022
  • Xin Yan
  • Songping Wu
  • Mingfeng Xue
  • Chi Kin Benjamin Leung
  • Daryl G. Beetner, Missouri University of Science and Technology
  • Jianmin Zhang
Abstract

Multilayer ceramic capacitors (MLCCs) are widely used in modern electronics. Due to the piezoelectric effect of the ceramic material, however, MLCCs subjected to electrical noise may vibrate and generate acoustic noise, as 'singing'. Acoustic noise can be annoying for users, especially within mobile devices, so it becomes important to perform acoustic noise analysis before a product is released. In this paper, a practical simulation flow for singing capacitor based acoustic noise is presented. The simulation flow and analysis method are developed on Ansys Sherlock and Mechanical. In Ansys Sherlock, local library and Approved Vendor List (AVL) files were used to build the model efficiently. After the PCB and all parts were set correctly, the model was imported to Ansys Mechanical for further modal analysis and harmonic analysis. Using the proposed simulation flow the simulation model could be easily created, and the inherent vibration properties and frequency response of the structure could be estimated.

Department(s)
Electrical and Computer Engineering
Keywords and Phrases
  • Ansys,
  • harmonic analysis,
  • modal analysis,
  • Simulation flow
International Standard Book Number (ISBN)
978-166540929-2
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2023 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
1-1-2022
Publication Date
01 Jan 2022
Citation Information
Xin Yan, Songping Wu, Mingfeng Xue, Chi Kin Benjamin Leung, et al.. "A Practical Simulation Flow for Singing Capacitor based Acoustic Noise Analysis" 2022 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2022 (2022) p. 29 - 33
Available at: http://works.bepress.com/daryl-beetner/128/