Article
Power Integrity Concepts for High-Speed Design on Multi-Layer PCBs
Proceedings of the 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (2018, Long Beach, CA)
Meeting Name
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018 (2018: Jul. 30-Aug. 3, Long Beach, CA)
Department(s)
Electrical and Computer Engineering
International Standard Book Number (ISBN)
978-1-5386-6621-0
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2018 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
7-1-2018
Publication Date
01 Jul 2018
Disciplines
Citation Information
Chulsoon Hwang. "Power Integrity Concepts for High-Speed Design on Multi-Layer PCBs" Proceedings of the 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (2018, Long Beach, CA) (2018) Available at: http://works.bepress.com/chulsoon-hwang/64/