Article
Return Path Discontinuity Analysis of an Edge Mount SMA Launch Structure in Multilayer Boards
IEEE Transactions on Electromagnetic Compatibility
Abstract
Return-path discontinuity of an edge-mount SubMiniature version A (SMA) launch structure in multilayer boards, widely used in high-frequency fixtures and boards, is analyzed, and a simple equation to quantitatively estimate the frequency bandwidth without signal distortions is proposed. The proposed equations are experimentally validated for various physical dimensions, and a simple circuit model is demonstrated to take the return-path discontinuity into account in the channel simulations. In addition, based on the understanding of the return current discontinuity, quantitative design guides are drawn and a technique using an edge plating to enhance the bandwidth up to 50 GHz is demonstrated.
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
- De-embedding,
- Fixture,
- Launch structure,
- Multilayer high-speed board,
- SubMiniature version A (SMA) connector
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2018 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
4-1-2018
Publication Date
01 Apr 2018
Disciplines
Citation Information
Chulsoon Hwang, Muqi Ouyang and Jun Fan. "Return Path Discontinuity Analysis of an Edge Mount SMA Launch Structure in Multilayer Boards" IEEE Transactions on Electromagnetic Compatibility Vol. 60 Iss. 2 (2018) p. 453 - 458 ISSN: 0018-9375 Available at: http://works.bepress.com/chulsoon-hwang/48/
This paper was supported in part by the National Science Foundation under Grant IIP-1440110.