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Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multilayer PCBs
IEEE Transactions on Electromagnetic Compatibility
  • Myunghoi Kim
  • Kyoungchoul Koo
  • Yujeong Shim
  • Chulsoon Hwang, Missouri University of Science and Technology
  • Junso Pak
  • Seungyoung Ahn
  • Joungho Kim
Abstract

In this paper, we propose a vertical stepped impedance electromagnetic bandgap (VSI-EBG) structure with a stopband enhancement and a size reduction for a wideband suppression of simultaneous switching noise (SSN) coupling in multilayer printed circuit boards (PCBs). The proposed VSI-EBG structure forms the stepped impedance EBG structure of power planes, which is implemented with a vertical branch, high-impedance (hi-Z) and low-impedance (low-Z) metal patches on different layers. Test vehicles are fabricated using a multilayer PCB process to verify the proposed VSI-EBG structure. Through experimental measurements, we verified the enhanced suppression of SSN coupling (below-40 dB) between 650 MHz and 20 GHz. In addition, we demonstrated that fL is reduced from 2.4 GHz to 650 MHz compared to the previous EBG structure, which allows an approximately 86% size reduction.

Department(s)
Electrical and Computer Engineering
Keywords and Phrases
  • Electromagnetic Bandgap (EBG),
  • Printed Circuit Board (PCB),
  • Simultaneous Switching Noise (SSN),
  • Size Reduction,
  • Stepped Impedance,
  • Stopband Enhancement,
  • Vertical EBG
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2013 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
1-1-2013
Publication Date
01 Jan 2013
Citation Information
Myunghoi Kim, Kyoungchoul Koo, Yujeong Shim, Chulsoon Hwang, et al.. "Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multilayer PCBs" IEEE Transactions on Electromagnetic Compatibility Vol. 55 Iss. 2 (2013) p. 307 - 314 ISSN: 0018-9375
Available at: http://works.bepress.com/chulsoon-hwang/46/