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Protection of a Delay-Locked Loop from Simultaneous Switching Noise Coupling using an On-Chip Electromagnetic Bandgap Structure
Proceedings of the 2012 IEEE International Symposium on Electromagnetic Compatibility (2012, Pittsburgh, PA)
  • Chulsoon Hwang, Missouri University of Science and Technology
  • Kiyeong Kim
  • Junso Pak
  • Joungho Kim
Abstract

An on-chip electromagnetic bandgap (EBG) structure is applied to protect a delay-locked loop (DLL) from simultaneous switching noise (SSN) coupling. The fabricated on-chip EBG structure has a low cut-off frequency of approximately 1 GHz. An accumulation-mode MOS capacitor is used to achieve a high layout efficiency for the MOS capacitor and therefore a large value of capacitance for the same layout area. The on-chip EBG structure is embedded in the middle of an on-chip power distribution network in which the DLL and an inverter chain acting as a noise source are connected. The measured results showed that the jitter at the DLL clock output is severely increased by the coupled SSN from the inverter chain. However, the operation of the inverter chain did not affect the jitter when the DLL was protected by the on-chip EBG structure.

Meeting Name
2012 IEEE International Symposium on Electromagnetic Compatibility, EMC 2012 (2012: Aug. 5-10, Pittsburgh, PA)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
  • Dielectric Devices,
  • Electromagnetic Compatibility,
  • Metamaterials,
  • MOS Capacitors,
  • Sanitary Sewers,
  • Switching
International Standard Book Number (ISBN)
978-146732061-0
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2012 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
8-1-2012
Publication Date
01 Aug 2012
Citation Information
Chulsoon Hwang, Kiyeong Kim, Junso Pak and Joungho Kim. "Protection of a Delay-Locked Loop from Simultaneous Switching Noise Coupling using an On-Chip Electromagnetic Bandgap Structure" Proceedings of the 2012 IEEE International Symposium on Electromagnetic Compatibility (2012, Pittsburgh, PA) (2012) p. 544 - 548 ISSN: 1077-4076
Available at: http://works.bepress.com/chulsoon-hwang/42/