Article
Differential Signal Via Shield with Narrow Via Pitch Partial Electromagnetic Bandgap Structure
Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2010, Fort Lauderdale, FL)
Abstract
This paper presents a signal via shielding method in a printed circuit board with the narrow via pitch partial electromagnetic bandgap (NVP-PEBG) structure. The NVP-PEBG structure was developed to shield a small area such as a signal via with wideband isolation and compact size. This NVP-PEBG structure showed excellent noise isolation for a single-ended signal via. In this paper, the NVP-PEBG structure is applied to a differential signal via and its performance with the differential signal via is demonstrated in coupling against the noise in a power and ground plane.
Meeting Name
2010 IEEE International Symposium on Electromagnetic Compatibility, EMC 2010 (2010: Jul. 25-30, Fort Lauderdale, FL)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
- Electromagnetic Compatibility,
- Electromagnetism,
- Electronic Equipment Manufacture,
- Energy Gap,
- Metamaterials,
- Printed Circuit Boards,
- Radiation Protection
International Standard Book Number (ISBN)
978-142446305-3
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2010 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
7-1-2010
Publication Date
01 Jul 2010
Disciplines
Citation Information
Chulsoon Hwang, Minchul Shin, Junso Pak and Joungho Kim. "Differential Signal Via Shield with Narrow Via Pitch Partial Electromagnetic Bandgap Structure" Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2010, Fort Lauderdale, FL) (2010) p. 451 - 454 ISSN: 1077-4076 Available at: http://works.bepress.com/chulsoon-hwang/24/