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Article
Extracting Characteristic Impedance of a Transmission Line Referenced to a Meshed Ground Plane
Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2016, Ottawa, Canada)
  • Jiayi He
  • Chulsoon Hwang, Missouri University of Science and Technology
  • Jingnan Pan
  • Gyu-Yeong Cho
  • Bumhee Bae
  • Hark-Byeong Park
  • Jun Fan, Missouri University of Science and Technology
Abstract

Meshed power and ground planes are commonly used in today's flexible printed circuit board (PCB). In this paper, a methodology to extract the effective characteristic impedance as well as the per-unit-length parameters of a transmission line with a meshed reference plane is proposed based on an equivalent transmission line model. The validity of this methodology is confirmed through comparison with full-wave simulations.

Meeting Name
2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016 (2015: Jul. 25-29, Ottawa, Canada)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Center for High Performance Computing Research
Second Research Center/Lab
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
  • Electric lines,
  • Electromagnetic compatibility,
  • Flexible electronics,
  • Characteristic impedance,
  • Effective characteristics,
  • Equivalent transmission line,
  • Flexible printed circuit boards,
  • Full-wave simulations,
  • Meshed ground planes,
  • Per unit length,
  • Power and ground planes,
  • Printed circuit boards,
  • transmission line
International Standard Book Number (ISBN)
978-150901441-5
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2016 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
9-1-2016
Publication Date
01 Sep 2016
Citation Information
Jiayi He, Chulsoon Hwang, Jingnan Pan, Gyu-Yeong Cho, et al.. "Extracting Characteristic Impedance of a Transmission Line Referenced to a Meshed Ground Plane" Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2016, Ottawa, Canada) (2016) p. 651 - 656 ISSN: 1077-4076
Available at: http://works.bepress.com/chulsoon-hwang/17/