Article
Static I-V based PIM Evaluation for Spring and Fabric-Over-Foam Contacts
2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023
Abstract
Spring Clips and Fabric-Over-Foams (FOFs) Are Widely Used in Mobile Devices for Electrical Connection Purposes. However, the Imperfect Metallic Connections Tend to Induce Passive Intermodulation (PIM), Resulting in a Receiver Sensitivity Degradation, Known as RP Desensitization. Due to the Complexity of the PIM Characterization, there is Not Yet a Way to Evaluate PIM Performance using a Simple Setup for Environments Like Factories. in This Paper, a Current-Voltage (I-V) Behavior-Based PIM Evaluation Method is Proposed and Validated with Various Metallic Contacts and Contact Forces. the Test Results Demonstrated the Feasibility of the PIM Performance Evaluation based on the Measured Static I-V Curve.
Department(s)
Mechanical and Aerospace Engineering
Second Department
Electrical and Computer Engineering
Keywords and Phrases
- 1-V curve,
- fabric-over-foam,
- passive intermodulation (PIM),
- radio frequency interference (RFI),
- spring contacts
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2023 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
1-1-2023
Publication Date
01 Jan 2023
Citation Information
Kalkidan W. Anjajo, Yang Xu, Shengxuan Xia, Yuchu He, et al.. "Static I-V based PIM Evaluation for Spring and Fabric-Over-Foam Contacts" 2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023 (2023) p. 83 - 87 Available at: http://works.bepress.com/chulsoon-hwang/143/
National Science Foundation, Grant HP-1916535