Article
Designing Test Patterns for Effective Measurement of Typical TSV Pairs in a Silicon Interposer
Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2014, Tokyo, Japan)
Abstract
In this paper, practical test patterns are designed to calculate the characteristics of Through-Silicon Via (TSV) pairs in a silicon interposer. Proposed test patterns include probing pads, traces and TSVs, which are modeled by a combination of impedances and admittances. Performance of the test patterns is obtained from simulation models built in full wave simulation solver. TSV response is then obtained by de-embedding the pad and trace from the test patterns. The TSV response is also verified by analytical TSV characterization and full wave simulation results for only TSV structures. Thus the paper provides a guide to design feasible test structures from which true response of a TSV pair can be derived.
Meeting Name
2014 International Symposium on Electromagnetic CompatibiIity, EMC 2014 (2014: May 12-16, Tokyo, Japan)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Center for High Performance Computing Research
Second Research Center/Lab
Electromagnetic Compatibility (EMC) Laboratory
Comments
The Institute of Electronics, Information and Communication Engineers, Communications Society (IEICE-CS)
Keywords and Phrases
- Electromagnetic compatibility,
- Electronics packaging,
- Integrated circuit interconnects,
- Integrated circuit manufacture,
- Silicon,
- analytical,
- De-embedding,
- Full-wave simulations,
- Practical tests,
- Silicon interposers,
- Test structure,
- Through-Silicon-Via (TSV),
- TSV,
- Three dimensional integrated circuits
International Standard Book Number (ISBN)
978-488552287-1
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2014 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
12-1-2014
Publication Date
01 Dec 2014
Citation Information
Qian Wang, Ketan Shringarpure, Jun Fan, Chulsoon Hwang, et al.. "Designing Test Patterns for Effective Measurement of Typical TSV Pairs in a Silicon Interposer" Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2014, Tokyo, Japan) (2014) p. 382 - 385 ISSN: 1077-4076 Available at: http://works.bepress.com/chulsoon-hwang/14/