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Article
A SPICE-Compatible Model to Simulate RFI-Induced Buzz Noise Problem in a Camera
IEEE Transactions on Electromagnetic Compatibility
  • Wei Zhang
  • Shengxuan Xia
  • Xin Fang
  • Xu Wang
  • Takashi Enomoto
  • Hideki Shumiya
  • Kenji Araki
  • Chulsoon Hwang, Missouri University of Science and Technology
Abstract

This article proposeda SPICE-compatible model to fast simulate the buzz noise problem in a camera device. Based on the reciprocity theorem, the proposed SPICE-compatible model consists of cascaded scattering (S) parameters extracted from the field coupling. It can provide an accurate estimation of the buzz noise transfer function (TFtotal) between the radio-frequency antenna and the audio system within an average error of 1 dB. Besides, the proposed model allows for coupling decomposition by separating the audio system into different regions, fast buzz noise mitigation by adding filtering circuits, and fast antenna evaluation/selection by characterizing the TFtotal with different antenna structures. The advantage of the proposed model is that, instead of multiple 3-D simulations during the predesign-stage troubleshooting, it is a fast SPICE-compatible method with SPICE simulation time of 4.5 min and one-time 3-D full-wave simulation on the camera system studied. It provides quick estimation on the potential buzz noise problems, coupling decomposition,buzz noise mitigation methods, and selection of antenna structures.

Department(s)
Electrical and Computer Engineering
Keywords and Phrases
  • Buzz Noise,
  • Radio-Frequency Interference (RFI),
  • Reciprocity Theorem,
  • SPICE-Compatible Model,
  • Transfer Function
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2022 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
8-1-2022
Publication Date
01 Aug 2022
Citation Information
Wei Zhang, Shengxuan Xia, Xin Fang, Xu Wang, et al.. "A SPICE-Compatible Model to Simulate RFI-Induced Buzz Noise Problem in a Camera" IEEE Transactions on Electromagnetic Compatibility Vol. 64 Iss. 4 (2022) p. 987 - 998 ISSN: 1558-187X; 0018-9375
Available at: http://works.bepress.com/chulsoon-hwang/115/