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Article
Mechanical Strain Dependence of Thermal Transport in Amorphous Silicon Thin Films
Nanoscale and Microscale Thermophysical Engineering
  • Tarekul Alam, Pennsylvania State University - Main Campus
  • Raghu Pulavarthy, Pennsylvania State University - Main Campus
  • Christopher Muratore, University of Dayton
  • M. Amanul Haque, Pennsylvania State University - Main Campus
Document Type
Article
Publication Date
1-1-2015
Abstract
Recent computational studies predict mechanical strain–induced changes in thermal transport, which is yet to be validated by experimental data. In this article, we present experimental evidence of an increase in thermal conductivity of nominally 200-nm-thick freestanding amorphous silicon thin films under externally applied tensile loading. Using a combination of nanomechanical testing and infrared microscopy, we show that 2.5% tensile strain can increase thermal conductivity from 1 to 2.4 W/m-K. We propose that such an increase in thermal conductivity might be due to strain-induced changes in microstructure and/or carrier density. Microstructural and optical reflectivity characterization through Raman and infrared spectroscopy are presented to investigate this hypothesis.
Inclusive pages
1-16
ISBN/ISSN
1556-7265
Comments

Permission documentation is on file.

Publisher
Taylor & Francis
Peer Reviewed
Yes
Citation Information
Tarekul Alam, Raghu Pulavarthy, Christopher Muratore and M. Amanul Haque. "Mechanical Strain Dependence of Thermal Transport in Amorphous Silicon Thin Films" Nanoscale and Microscale Thermophysical Engineering Vol. 19 Iss. 1 (2015)
Available at: http://works.bepress.com/christopher-muratore/58/