Skip to main content
Article
A Novel Method of Detecting Missing Parallel/Multiple Bond-wires in microwave transistors that is amenable to integration with automated test handlers
Proc. of 2007 IEEE Regional Symposium on Microelectronics (2007)
  • Chin-Leong Lim
Abstract

A method of detecting a missing parallel-connected bond-wires in packaged microwave transistors is described. Instead of the conventional way of testing the transistor in the amplifier configuration, the new method tests the device as an oscillator. Using the oscillation frequency as the screening criterion reduces test complexity and allows easy integration with existing automated test handlers

Keywords
  • Parallel bond-wires,
  • multiple bond-wires,
  • parallel wirebonds,
  • wire-bonding defect,
  • microwave transistor packaging
Publication Date
December, 2007
Citation Information
Chin-Leong Lim. "A Novel Method of Detecting Missing Parallel/Multiple Bond-wires in microwave transistors that is amenable to integration with automated test handlers" Proc. of 2007 IEEE Regional Symposium on Microelectronics (2007)
Available at: http://works.bepress.com/chin-leong_lim/6/