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Article
Application of Carbon Nanotubes to Thermal Interface Materials
Electrical and Computer Engineering
  • Drazen Fabris, Santa Clara University
  • Michael Rosshirt
  • Christopher Cardenas
  • Patrick Wilhite, Santa Clara University
  • Toshishige Yamada, Santa Clara University
  • Cary Y. Yang, Santa Clara University
Document Type
Article
Publication Date
6-7-2011
Publisher
The American Society of Mechanical Engineers
Abstract

Improvements in thermal interface materials (TIMs) can enhance heat transfer in electronics packages and reduce high temperatures. TIMs are generally composed of highly conductive particle fillers and a matrix that allows for good surface wetting and compliance of the material during application. Two types of TIMs are tested based on the addition of carbon nanotubes (CNTs): one mixed with a commercial TIM product and the other only CNTs and silicone oil. The materials are tested using an in-house apparatus that allows for the simultaneous measurement of temperature, pressure, heat flux, and TIM thickness. Results show that addition of large quantities of CNTs degrades the performance of the commercial TIM, while the CNT-silicone oil mixtures showed improved performance at high pressures. Thickness and pressure measurements indicate that the CNT-thermal grease mixtures are more compliant, with a small increase in bulk thermal conductivity over the range of tested pressures.

Citation Information
D. Fabris, M. Rosshirt, C. Cardenas, P. Wilhite, T. Yamada, and C.Y. Yang, “Application of Carbon Nanotubes to Thermal Interface Materials,” Journal of Electronic Packaging (Transactions of the ASME) 133, 020902 (6 pp) (2011).