Spectrally and Temporally Engineered Processing using Photoelectrochemistry (US Patent filed January 2016)(2013)
Methods and apparatus for subtractively fabricating three-dimensional structures relative to a surface of a substrate and for additively depositing metal and dopant atoms onto the surface and for diffusing them into the bulk. A chemical solution is applied to the surface of the semiconductor substrate, and a spatial pattern of electron-hole pairs is generated by projecting a spatial pattern of illumination characterized by a specified intensity, wavelength and duration at each pixel of a plurality of pixels on the surface. An electrical potential is applied across the interface of the semiconductor and the solution with a specified temporal profile relative to the temporal profile of the spatial pattern of illumination. Such methods are applied to the fabrication of a photodetector integral with a parabolic reflector, cell size sorting chips, a three-dimensional photonic bandgap chip, a photonic integrated circuit, and an integrated photonic microfluidic circuit.
- photochemical etching,
- three-dimensional structures,
Publication DateApril 28, 2013
Citation InformationLynford Goddard, Kaiyuan Wang, Chris Edwards, Xing Yu, et al.. "Spectrally and Temporally Engineered Processing using Photoelectrochemistry (US Patent filed January 2016)" (2013)
Available at: http://works.bepress.com/britt-carlson/10/