"Thermal Analysis: An Effective Tool for Evaluating Electronic Materials" by Bonnie Bachman

Article

Thermal Analysis: An Effective Tool for Evaluating Electronic Materials

Proceedings of the 26th Conference of the Japan Society of Calorimetry and Thermal Analysis (1990, Hakozaki, Fukuoka, Japan)

Bonnie Bachman, Missouri University of Science and Technology

Meeting Name

26th Conference of the Japan Society of Calorimetry and Thermal Analysis (1990: Nov. 21-22, Hakozaki, Fukuoka, Japan)

Department(s)

Economics

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

Publication Date

11-22-1990

Publication Date

22 Nov 1990

Disciplines

Materials Science and Engineering

Citation Information

Bonnie Bachman. "Thermal Analysis: An Effective Tool for Evaluating Electronic Materials" Proceedings of the 26th Conference of the Japan Society of Calorimetry and Thermal Analysis (1990, Hakozaki, Fukuoka, Japan) (1990) p. 3
Available at: http://works.bepress.com/bonnie-bachman/25/