Skip to main content
Article
A CFD Analysis of Telecommunication Racks, Including Effects of Air Filter Locations
Advances in Electronic Packaging, Parts A, B, and C
  • L. T. Yeh
  • Benjamin T.F. Chung, University of Akron Main Campus
  • Joseph Yeh
Document Type
Conference Proceeding
Publication Date
7-17-2005
Citation Information
L. T. Yeh, Benjamin T.F. Chung and Joseph Yeh. "A CFD Analysis of Telecommunication Racks, Including Effects of Air Filter Locations" Advances in Electronic Packaging, Parts A, B, and C Iss. Paper No. IPACK2005-73008 (2005) p. 1359 - 1364
Available at: http://works.bepress.com/benjamin_chung/19/