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Article
Thermal Analysis on Planar Interface Stability in Solidification of Semitransparent Materials
Journal of Thermophysics and Heat Transfer
  • Guo-Xiang Wang, University of Akron Main Campus
  • Chengcai Yao
  • Benjamin T.F. Chung, University of Akron Main Campus
Document Type
Article
Publication Date
4-1-2003
Abstract
Significant melt undercooling may be developed in the melt in front of the solid/liquid interface during solidification of semitransparent materials because of internal radiative heat transfer with the environment. A nonequilibrium plana interface solidification model has been developed recently to permit the melt undercooling near the interface. A thermal analysis is presented for the stability of such a planar interface. . .
Citation Information
Guo-Xiang Wang, Chengcai Yao and Benjamin T.F. Chung. "Thermal Analysis on Planar Interface Stability in Solidification of Semitransparent Materials" Journal of Thermophysics and Heat Transfer Vol. 17 Iss. 2 (2003) p. 193 - 198
Available at: http://works.bepress.com/benjamin_chung/15/