Thermal Analysis on Planar Interface Stability in Solidification of Semitransparent MaterialsJournal of Thermophysics and Heat Transfer
AbstractSignificant melt undercooling may be developed in the melt in front of the solid/liquid interface during solidification of semitransparent materials because of internal radiative heat transfer with the environment. A nonequilibrium plana interface solidification model has been developed recently to permit the melt undercooling near the interface. A thermal analysis is presented for the stability of such a planar interface. . .
Citation InformationGuo-Xiang Wang, Chengcai Yao and Benjamin T.F. Chung. "Thermal Analysis on Planar Interface Stability in Solidification of Semitransparent Materials" Journal of Thermophysics and Heat Transfer Vol. 17 Iss. 2 (2003) p. 193 - 198
Available at: http://works.bepress.com/benjamin_chung/15/