The numerical solution of the integral equations derived in Part I of this work is developed and the critical stresses and displacements are calculated. These results indicate that interleaves increase the interfacial damage tolerance and significantly relieve the stresses in the undamaged plies. Interface (H-shaped) cracks have a stable growth with the mode I opening stress becoming compressive after a small longitudinal growth. Additional interface crack extension is due to shear stresses (mode II) only. In order to recommend an interleaf thickness-to-layer width ratio, the influence of relative material properties, structural weight, and stress reduction is studied.