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Article
Nanoindentation and micro-mechanical fracture toughness of electrodeposited nanocrystalline Ni-W alloy films
Thin Solid Films (2012)
Abstract

Nanocrystalline nickel-tungsten alloys have great potential in the fabrication of components for microelectromechanical systems. Here the fracture toughness of Ni-12.7 at.%W alloy micro-cantilever beams was investigated. Micro-cantilevers were fabricated by UV lithography and electrodeposition and notched by focused ion beam machining. Load was applied using a nanoindenter and fracture toughness was calculated from the fracture load. Fracture toughness of the Ni-12.7 at.%W was in the range of 1.49-5.14 MPa √m. This is higher than the fracture toughness of Si (another important microelectromechanical systems material), but considerably lower than that of electrodeposited nickel and other nickel based alloys. © 2012 Elsevier B.V. All rights reserved.

Keywords
  • Fracture,
  • Micromechanics,
  • Nanostructured materials,
  • Non-ferrous alloys,
  • Electro-deposited nickel,
  • Focused ion beam machinin,
  • Fracture load,
  • Micro-cantilevers,
  • Micro-mechanical,
  • Microcantilever beams,
  • Nano-structured,
  • Nanocrystallines,
  • Nanoindenters,
  • Ni-W alloy,
  • Nickel based alloy,
  • Nickel-tungsten alloy,
  • Nonferrous alloy,
  • UV lithography,
  • Cerium alloys,
  • Electrodeposition,
  • Electromechanical devices,
  • Mechatronics,
  • MEMS,
  • Nanoindentation,
  • Nickel,
  • Tungsten alloys
Publication Date
April 30, 2012
Citation Information
"Nanoindentation and micro-mechanical fracture toughness of electrodeposited nanocrystalline Ni-W alloy films" Thin Solid Films Vol. 520 Iss. 13 (2012)
Available at: http://works.bepress.com/asmd_haseeb/36/