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Effects of reflow on the interfacial characteristics between Zn nanoparticles containing Sn-3.8Ag-0.7Cu solder and copper substrate
Soldering & Surface Mount Technology (2013)
Abstract

Purpose - The purpose of this paper is to investigate the effects of zinc (Zn) nanoparticles on the interfacial intermetallic compounds (IMCs) between Sn-3.8Ag-0.7Cu (SAC) solder and Cu substrate during multiple reflow. Design/methodology/approach - The nanocomposite solders were prepared by manually mixing of SAC solder paste with varying amounts of Zn nanoparticles. The solder pastes were reflowed on a hotplate at 250 C for 45 s for up to six times. The actual Zn content after reflow was analyzed by inductively coupled plasma-optical emission spectroscopy (ICP-OES). The wetting behavior of the solders was characterized by analyzing the contact angles and spreading rates according to the Japanese Industrial Standard (JIS 23198-3, 2003). The interfacial microstructure of the solder joints were investigated by field emission scanning electron microscope (FESEM) and energy dispersive X-ray spectroscopy (EDAX). Findings - It was found that upon the addition of 0.3 wt% Zn nanoparticles to the SAC solder, the growth of interfacial intermetallic compound (IMC) layers was retarded to a minimum value. Excessive amount of Zn nanoparticles (0.8 wt%) induced an additional IMC layer (Cu5Zn 8) which increased the total IMC thickness and raising the reliability issue. Originality/value - It is concluded that Zn nanoparticles undergo melting/reaction during reflow and impart their effect on the IMCs through alloying effects. © Emerald Group Publishing Limited.

Keywords
  • Copper,
  • Flow,
  • Intermetallic compounds,
  • Nanocomposite solder,
  • Reflow,
  • Solder,
  • Zn nanoparticles,
  • Energy dispersive X ray spectroscopy,
  • Field emission scanning electron microscopes,
  • Inductively coupled plasma-optical emission spectroscopy,
  • Japanese industrial standards,
  • Contact angle,
  • Copper compounds,
  • Emission spectroscopy,
  • Inductively coupled plasma,
  • Intermetallics,
  • Nanocomposites,
  • Nanoparticles,
  • Silver,
  • Soldering alloys,
  • X ray spectroscopy,
  • Zinc,
  • Tin
Publication Date
2013
Citation Information
"Effects of reflow on the interfacial characteristics between Zn nanoparticles containing Sn-3.8Ag-0.7Cu solder and copper substrate" Soldering & Surface Mount Technology Vol. 25 Iss. 2 (2013)
Available at: http://works.bepress.com/asmd_haseeb/29/