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Article
Die attach properties of Zn-Al-Mg-Ga based high-temperature lead-free solder on Cu lead-frame
Journal of Materials Science-Materials in Electronics (2012)
Keywords
  • Acceptable limit,
  • Bulk solder,
  • Die attachment,
  • Electrical tests,
  • Entire die,
  • Forming gas,
  • High temperature,
  • IMC layer,
  • Lead free solders,
  • Lead-frame,
  • Melting range,
  • Output voltages,
  • Solder wires,
  • Thermal cycle,
  • Aluminum,
  • Copper compounds,
  • Dies,
  • Gallium,
  • Gallium alloys,
  • Lead,
  • Lead compounds,
  • Silicon,
  • Silver alloys,
  • Soldering alloys,
  • Tin,
  • Zinc,
  • Zinc alloys,
  • Copper
Publication Date
January 1, 2012
Citation Information
"Die attach properties of Zn-Al-Mg-Ga based high-temperature lead-free solder on Cu lead-frame" Journal of Materials Science-Materials in Electronics Vol. 23 Iss. 1 (2012)
Available at: http://works.bepress.com/asmd_haseeb/18/