Skip to main content
Article
Mechanistic Understanding of Material Detachment During Micro-Scale Polishing
Journal of Manufacturing Science and Engineering
  • W. Che, Iowa State University
  • Y. Guo, Iowa State University
  • Abhijit Chandra, Iowa State University
  • Ashraf F. Bastawros, Iowa State University
Document Type
Article
Publication Version
Published Version
Publication Date
11-1-2003
DOI
10.1115/1.1619964
Abstract

A combined experimental and modeling approach has been devised to understand the material removal mechanism during abrasion of ductile copper discs. First, single grit scratch intersection experiments are conducted at the micro-scale (with 1-30 mm depth of cut). This is followed by FEM analysis. Then a simple analytical model is developed, and the model prediction is verified against experimental observations and results from numerical simulations. A characteristic material detachment length is correlated between experimental observations and model predictions. The insights gained from this exercise may be used to develop a mechanistic model of material removal in chemical mechanical polishing (CMP) of ductile materials.

Comments

This article is from Journal of Manufacturing Science and Engineering 125 (2003): 731, doi: 10.1115/1.1619964. Posted with permission.

Copyright Owner
ASME
Language
en
File Format
application/pdf
Citation Information
W. Che, Y. Guo, Abhijit Chandra and Ashraf F. Bastawros. "Mechanistic Understanding of Material Detachment During Micro-Scale Polishing" Journal of Manufacturing Science and Engineering Vol. 125 Iss. 4 (2003) p. 731 - 735
Available at: http://works.bepress.com/ashraf-bastawros/20/