"Enhanced thermal conduction and influence of interfacial resistance within flexible high aspect ratio copper nanowire/polymer composites" by Amit Rai

Article

Enhanced thermal conduction and influence of interfacial resistance within flexible high aspect ratio copper nanowire/polymer composites

Composites Science and Technology (2017)

Amit Rai, Louisiana Tech University
Arden L. Moore, Louisiana Tech University

Link

Disciplines

Materials Science and Engineering

Publication Date

May 1, 2017

DOI

10.1016/j.compscitech.2017.03.020

Citation Information

Amit Rai and Arden L. Moore. "Enhanced thermal conduction and influence of interfacial resistance within flexible high aspect ratio copper nanowire/polymer composites" Composites Science and Technology Vol. 144 (2017) p. 70 - 78
Available at: http://works.bepress.com/arden-l-moore/18/