Carbon nanotubes (CNTs) and carbon nanofibers (CNFs) are potential materials for high-performance electronic devices and circuits due to their light weight and excellent electrical properties such as high current capacity and tolerance to electromigration. In addition, at high frequencies, these materials exhibit transport behavior which holds special promise for applications as on-chip interconnects. Contact resistance at CNF-metal interface is a major factor in limiting the electrical performance of CNF interconnects at all frequencies. In this paper, it is demonstrated that the contact resistance can be minimized and the high-frequency characteristics much enhanced by depositing tungsten on CNF-metal electrode contacts.