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Article
Metallic Thin Film Growth on Vicinal Cu Substrates
Surface Science (2010)
  • Andreas Riemann, Western Washington University
  • Benjamin N. Satterwhite
  • Brandon E. Owens
Abstract
In this study we have investigated the heteroepitaxial growth of nickel and silver on vicinal copper substrates. Nickel was deposited onto a (211) substrate. The low lattice mismatch between copper and nickel of 2.5% enables epitaxial bidimensional growth in the substrate's orientation, where the strain can be accommodated in the overlaying film. On the contrary, copper and silver have a much larger mismatch of about 13% which usually cannot be accommodated in the film. In general, Ag is known to form alloys or to induce faceting on a stepped Cu surfaces. Here, silver was deposited onto a Cu(311) facet covered with a monatomic layer of NaCl. For the first time we show that Ag can be grown as ultrathin film in the substrates's orientation on a stepped surface using NaCl as a novel surfactant material.
Keywords
  • Vicinal single-crystal surfaces,
  • Metallic films,
  • Copper,
  • Nickel,
  • Silver,
  • LEED,
  • STM
Publication Date
November, 2010
Publisher Statement
Copyright © 2010 Elsevier B.V. All rights reserved. DOI: 10.1016/j.susc.2010.09.008
Citation Information
Andreas Riemann, Benjamin N. Satterwhite and Brandon E. Owens. "Metallic Thin Film Growth on Vicinal Cu Substrates" Surface Science Vol. 604 Iss. 23-24 (2010)
Available at: http://works.bepress.com/andreas_riemann/4/